Coulometric Thickness Tester DJHE.docx

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Coulometric Thickness Tester DJHE.docx

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Coulometric Thickness Tester DJHE.docx

CoulometricThicknessTesterDJHE

CoulometricThicknessTester

DJH-E

Instruction

Pleasereadthismanualcarefullybeforeusingthetester

DECLARE:

1.Theinformationofthecopyright

don’tcopy,useortranslateuntilpermittedtoCOATTEST

2.Declaretotheinformationguarantee

Theinformationcontainedinthisinstructionmayberevisedtimely,andwillnotinformyouagain.

COATTESTisnotresponsibleforthemeasurementerrorsresultingfromoperations,whichdonotconformtothisinstruction.

3.ThemeasurabletypesoftheplatingforthemodelDJH-EElectrolysisthickness-tester:

Au,Ag,Sn,Zn,Cu,Ni,andCr

Iftheconsumerrequiresincreasingmeasurementtypesoftheplating,pleasecontactwithCOATTEST

4.Caution:

Foryoursafety,pleasedon’topenthecoverofthetesterbyyourselfinordertoavoidaccidents.

Controlledinformation

Theinstructionisonlyprovidedwithlegalconsumers;don’tplagiarize,copyorpropagatethefullorsomecontentsoftheinstructionwithoutourpermission.Wewillneverpardonanytorttothisinstruction,evenresorttothelaw.

Weexpecttheconsumertocarefullyoperatetoassureself-legalrightsandinterests.

CONTENTS

ØFeatures……………………………………………………………………………………1

ØPrecaution………………………………………………………………………………….2

ØNomenclatureofprincipalpartsandcontrols……………………………………...3

ØNomenclatureofMeasuringStand……………………………………………………4

ØPre-checkbeforemeasurement…………………………………………………………5

ØHowtoselecttheelectrolyticsolutions……………………………………………....6

ØHowtomeasuretheplatingmetalofsinglelayer……………………………….….7

ØHowtomeasurethehardchromiumplating………………………………………..8

ØHowtomeasurethemulti-layerplating…………………………………………9~10

ØSolutioncomponentsandmethod

ØTimesetandtroubleshooting………………………………………………………13

ØSpecificationandstatement……………………………………………………...14

ØMaintenanceandsupport……………………………………………………………….15

FEATURES

☑Abletomeasuresinglemetallayer

☑Abletomeasuremulti-metallayer

☑Abletomeasuremetalcoatingsonplastics

☑Measurementisnotinfluencedbythesubstrate

☑LEDdisplay;printreportsdirectly

PRECAUTION

1.Avoidtemperaturechange

Whenmovedsuddenlyfromcoldtowarmplace,thetesterwillcausemeasurementuncertainty

2.Moistanddust

Avoidusingthistesterwherethereismuchmoistanddust,otherwise,theinnerpartsmaybedamaged

3.Avoidtoohighortoolowtemperature

Thetesterandsolutionsshouldavoiddirectsunlightandheatradiator.

Thetemperatureshouldbebelow30centigrade.Thegasketsmay

becomesoftbecauseoflowtemperature

4.Keeptheelectrode,electrolysiscellandgasketclean

Thescrewsandclipscontaminationmayinfluenceperformance.Theelectrolysiscellandgasketsubjectedtocontaminationwillleadtomeasurementerrors.

5.Avoidusingtheelectrolyticsolutionswhentemperatureistoolow

Avoidusingtheelectrolyticsolutionslowerthan10℃,somesolutionslikeA4,E4,A10,A12maycrystallizeandneedtoheatbeforeuse

6.Howtocleanthetester

Wipewithcleanandsoftcloth;don’tusecleaningliquidorotherchemicals,sprayingcleaneretc.

7.Don’tpilethingsonthetester

Thistestershouldbeplacedinevenandstraightplace,don’tstackotherthingsonit.

8.Thenormaltemperature

Pleaseusethistesterwithin20±5℃ofroomtemperature.

NOMENCLATUREOFPRINCIPALPARTSANDCONTROLS

Thicknessindicator

Measurementbutton

Useless

ACinputsocketandfuse

LED

Powerswitch

Cell

Stirringspeed-

adjustingknob

Outletofprintpaper

Clocksetbutton

Lidofpaperbox

SEL

Printerinput

Powerswitch

Printeroutput

PlatingofCrselect

button

Printbutton

Decreasingbutton

Increasingbutton

Resetbutton

Reversebutton

Stopbutton

Metalselectbuttons

Bracket

NOMENCLATUREOFMEASURINGSTAND

pre-checkbeforemeasurement

1.Placethetester,testingstandandthestandofthechemicalsontheworkingdeskinevenandstraight.

2.BesurethatthepowersupplyisAC220V.

3.connectthetesterwithteststandandprinterbycables

4.Pressanyselectplatingbutton,shortoutthesignalcliptotheterminalofsignalplug,turnonthepowerswitchandthenpressthemeasurementbutton,thestirrershouldrotateandthedisplayedbegintocount.Disconnecttheconnectinglinebetweenthesignalclipandtheterminalofsignalplug,thetestershouldimmediatelystoptocountandalarm.Theconditionofthetestercanbeconsideredasnormal.

5.Iftheprinterison,aftertheprocedure4,pressPRINTbutton,andCOAT,THICK,andTIMEwilldisplay

Howtoselecttheelectrolyticsolutions

Designationofelectrolyticsolutionsanddepositedmetalandbasecombinations

Plating

metals

Base

Steel

Copperanditsalloys

Aluminum

Nickel

Multi-layer

nickel

NdFeB

Gold（Au）

Silver（Ag）

Tin（Sn）

Zinc（Zn）

Copper

（Cu）

Nickel（Ni）

A10

Chromium

（Cr）

Howtomeasuretheplatingmetalsofsinglelayer

Example:

Themeasurementofthezincplatingwithwhitepassivationonthesteelsubstrate,it’sthicknessis10μm.

1.Usetherubbertowipeawaythepassivationfilmsonthesurfaceofzincplatingofthesampletobemeasured.

2.Pressthetestingheadverticallyonthesurfaceofthesampletobemeasured（untilnosolutionleaks）

3.ElectrolyticsolutionA8isselectedfromtable2forthecombinationofzincplatingonsteelsubstrate.Thecellmustbefilledwith2mloftheelectrolyticsolutionbyusingadropper.Thecellwillnotbefilledfull.（Thesolutionlevelisabout3mmfromtheopeningofthecell）

4.Insertpipettetothebottomoftheelectrolysiscell,repeatsuckingseveraltimesinordertoremovetheairbubblefromcell,enablestheelectrolyticsolutiontocontactcompletelywiththezincplatingbeforeplacingthestirrer

5.PresstheZnbutton.

6.Insertthesignalplugintotheholeofthescrewoftheelectrode,attachtheredsignalcliptotheplatedobjectandmakesureconnectioniscorrect.

7.pressthemeasurementbutton,thestirrerbeginsrotating,whilethebuzzeralarms,themeasurementwillbestoppedautomatically,thethickness12.2μmhasbeendisplayedontheindicator,pressthestopbutton.

8.raisethestirrer,removethewastesolutionandthesample

9.Rinsethestirrer,cleanuptheusedelectrolyticsolutionbyusingthepipette,rinsethetestinghead,removethesample

10.whentheprinterison,afterprocedure9pressPRINTbuttonandCOAT,THICKwilldisplay

Note

WhenmeasuretheplatingofAuorCr（decoratechromium）,depresstheTbuttonandtheAuorCrbuttonattheonetime.

Howtomeasurethehardchromiumplating

Example:

Themeasurementofthehardchromiumplatingonsteelsubstrate,thethicknessofthehardchromiumplatingis35μm.

1.Usetherubbertowipeawaythepassivationfilmsonthesurfaceofchromiumplatingofthearticletobemeasured.

2.Depressthetestingheadverticallyonthesurfaceofthearticletobemeasured,appliedanadequatepressureuntilwithoutanyleakage.

3.ElectrolyticsolutionA2isselectedfromtable2,thecellmustbefilledwith2mloftheelectrolyticsolutionbyusingadropper.Thecellwillnotbefilledfull.（Thesolutionlevelisabout3mmfromtheopeningofthecell）

4.Insertthepipetteintothebottomoftheelectrolysiscell.Repeatsuckseveraltimes,inordertoremovetheairbubblefromthecell,enablestheelectrolyticsolutiontocontactcompletelywiththechromiumplating.

Note:

Whenmeasuringthechromiumplatingplacingthestirrerisnotarequirement.

DepresstheplatingofCrselectbuttonandtheCrmeasurementbutton.（theplatingofCrselectbutton:

---measurethedecoratechromium---measurethehardchromium）

6.Insertthesignalplugintotheholeofthescrewoftheelectrode,attachtheredsignalcliptotheplatedobjectandbesurethataproperconnectionhasbeendone.

7.pressthemeasurementbutton,thestirrerbeginrotating,whenthethicknessof15μmshowsontheindicatorpressthestopbuttonthenpresstheprintbutton（ifnotthetestercouldnotworknormally）,renewtheelectrolyticsolution,againpressthemeasurementbutton.Renewaloftheelectrolyticsolutionshouldbemadeatfrequencyofeven15μmuntilbuzzing.Recordthethicknessofthehardchromiumplating.

8.Cleanuptheusedelectrolyticsolutionbyusingthepipette.Risethetestinghead.Removethearticle.

9.Cleanuptheinternalsurfaceofthecellandgasketbyrinsewaterandwiping.Besurethatthereisnotanyoxidationproductsonthembeforetheyarereplacedback.

Howtomeasurethemulti-layerplating

Example:

Themeasurementofthethicknessofthemulti-layerdepositsconsistingofcopper、nickelandchromiumplatingonthesteelsubstrate.Thethicknessofthecomponentlayersis0.4μmofchromium,14μmofnickel,10μmofcopper.

1.Usetherubbertowipeawaythepassivationfilmsonthesurfaceofplatingonthearticletobemeasured

2.Pressthetestingheadverticallyonthesurfaceofthearticletobemeasured,appliedanadequatepressureuntilwithoutanyleakage.

3.ElectrolyticsolutionA2isselectedfromtable2,thecellmustbefilledwith2mloftheelectrolyticsolutionbyusingadropper.Thecellwillnotbefilledfull.（Thesolutionlevelisabout3mmfromthecell）

4.Insertthepipetteintothebottomoftheelectrolysiscell.Repeatsuckingseveraltimes,inordertoremovetheairbubblefromthecell,maketheelectrolyticsolutioncontactcompletelywiththechromiumplating.

Note:

Whenmeasuringth

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