precon.docx

precon.docx

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precon

JOINT

INDUSTRY

STANDARD

Moisture/Reflow

SensitivityClassification

forNonhermetic

SolidStateSurface

MountDevices

IPC/JEDECJ-STD-020D.1

March2008

SupersedesIPC/JEDECJ-STD-020D

August2007

Notice

IPCandJEDECStandardsandPublicationsaredesignedtoservethepublic

interestthrougheliminatingmisunderstandingsbetweenmanufacturersand

purchasers,facilitatinginterchangeabilityandimprovementofproducts,and

assistingthepurchaserinselectingandobtainingwithminimumdelaythe

properproductforhisparticularneed.ExistenceofsuchStandardsand

Publicationsshallnotinanyrespectprecludeanymemberornonmember

ofIPCorJEDECfrommanufacturingorsellingproductsnotconforming

tosuchStandardsandPublications,norshalltheexistenceofsuchStandards

andPublicationsprecludetheirvoluntaryusebythoseotherthanIPCor

JEDECmembers,whetherthestandardistobeusedeitherdomestically

orinternationally.

RecommendedStandardsandPublicationsareadoptedbyIPCorJEDEC

withoutregardtowhethertheiradoptionmayinvolvepatentsonarticles,

materials,orprocesses.Bysuchaction,IPCorJEDECdonotassumeany

liabilitytoanypatentowner,nordotheyassumeanyobligationwhateverto

partiesadoptingtheRecommendedStandardorPublication.Usersarealso

whollyresponsibleforprotectingthemselvesagainstallclaimsofliabilities

forpatentinfringement.Thematerialinthisjointstandardwasdevelopedby

theIPCPlasticChipCarrierCrackingTaskGroup（B-10a）andtheJEDEC

JC-14.1CommitteeonReliabilityTestMethodsforPackagedDevices

ForTechnicalInformationContact:

JEDECIPC

SolidStateTechnologyAssociation3000LakesideDrive,Suite309S

2500WilsonBoulevardBannockburn,Illinois

Arlington,VA22201-383460015-1249

www.jedec.orgTel847615.7100

Fax847615.7105

PleaseusetheStandardImprovementFormshownattheendofthis

document.

©Copyright2008.JEDEC,Arlington,Virginia,andIPC,Bannockburn,Illinois.AllrightsreservedunderbothinternationalandPan-American

copyrightconventions.Anycopying,scanningorotherreproductionofthesematerialswithoutthepriorwrittenconsentofthecopyright

holderisstrictlyprohibitedandconstitutesinfringementundertheCopyrightLawoftheUnitedStates.

ASSOCIATIONCONNECTING

ELECTRONICSINDUSTRIES®

Supersedes:

IPC/JEDECJ-STD-020D-

August2007

IPC/JEDECJ-STD-020C-

July2004

IPC/JEDECJ-STD-020D.1

Moisture/Reflow

SensitivityClassification

forNonhermetic

SolidStateSurface

MountDevices

AjointstandarddevelopedbytheIPCPlasticChipCarrierCrackingTask

Group（B-10a）andtheJEDECJC-14.1CommitteeonReliabilityTest

MethodsforPackagedDevices

Usersofthisstandardareencouragedtoparticipateinthe

developmentoffuturerevisions.

Contact:

IPC/JEDECJ-STD-020B-

July2002

IPC/JEDECJ-STD-020A-

April1999

J-STD-020-October1996

JEDECJESD22-A112

IPC-SM-786A-January1995

IPC-SM-786-December1990

JEDEC

SolidStateTechnologyAssociation

2500WilsonBoulevard

Arlington,VA22201-3834

www.jedec.org

IPC

3000LakesideDrive,Suite309S

Bannockburn,Illinois

60015-1249

Tel847615.7100

Fax847615.7105

ThisPageIntentionallyLeftBlank

March2008

TableofContents

IPC/JEDECJ-STD-020D.1

1PURPOSE.................................................................1

1.1Scope......................................................................1

1.2Background............................................................1

1.3TermsandDefinitions............................................1

2APPLICABLEDOCUMENTS....................................2

2.1JEDEC....................................................................2

2.2IPC..........................................................................3

3APPARATUS.............................................................3

3.1TemperatureHumidityChambers..........................3

3.2SolderReflowEquipment......................................3

3.2.1FullConvection（Preferred）...................................3

3.2.2Infrared...................................................................3

3.3Ovens......................................................................3

3.4Microscopes............................................................3

3.4.1OpticalMicroscope................................................3

3.4.2AcousticMicroscope..............................................3

3.5Cross-Sectioning....................................................3

3.6ElectricalTest.........................................................4

3.7WeighingApparatus（Optional）.............................4

3.8BeadedThermocoupleTemperature

Measurement..............................