PCB行业专业词汇大全.docx
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PCB行业专业词汇大全
PCB行业专业词汇大全—马建整理
*ProcessModule說明:
A.下料(CutLamination)
a-1裁板(SheetsCutting)
a-2原物料發料(Panel)(ShearmaterialtoSize)
B.鑽孔(Drilling)
b-1內鑽(InnerLayerDrilling)
b-2一次孔(OuterLayerDrilling)
b-3二次孔(2ndDrilling)
b-4雷射鑽孔(LaserDrilling)(LaserAblation)
b-5盲(埋)孔鑽孔(Blind&BuriedHoleDrilling)
C.乾膜製程(PhotoProcess(D/F))
c-1前處理(Pretreatment)
c-2壓膜(DryFilmLamination)
c-3曝光(Exposure)
c-4顯影(Developing)
c-5蝕銅(Etching)
c-6去膜(Stripping)
c-7初檢(Touch-up)
c-8化學前處理,化學研磨(ChemicalMilling)
c-9選擇性浸金壓膜(SelectiveGoldDryFilmLamination)
c-10顯影(Developing)
c-11去膜(Stripping)
D.壓合Lamination
d-1黑化(BlackOxideTreatment)
d-2微蝕(Microetching)
d-3鉚釘組合(eyelet)
d-4疊板(Layup)
d-5壓合(Lamination)
d-6後處理(PostTreatment)
d-7黑氧化(BlackOxideRemoval)
d-8銑靶(spotface)
d-9去溢膠(resinflushremoval)
E.減銅(CopperReduction)
e-1薄化銅(CopperReduction)
F.電鍍(HorizontalElectrolyticPlating)
f-1水平電鍍(HorizontalElectro-Plating)(PanelPlating)
f-2錫鉛電鍍(Tin-LeadPlating)(PatternPlating)
f-3低於1mil(Lessthan1milThickness)
f-4高於1mil(Morethan1milThickness)
f-5砂帶研磨(BeltSanding)
f-6剝錫鉛(Tin-LeadStripping)
f-7微切片(Microsection)
G.塞孔(PlugHole)
g-1印刷(InkPrint)
g-2預烤(Precure)
g-3表面刷磨(Scrub)
g-4後烘烤(Postcure)
H.防焊(綠漆):
(SolderMask)
h-1C面印刷(PrintingTopSide)
h-2S面印刷(PrintingBottomSide)
h-3靜電噴塗(SprayCoating)
h-4前處理(Pretreatment)
h-5預烤(Precure)
h-6曝光(Exposure)
h-7顯影(Develop)
h-8後烘烤(Postcure)
h-9UV烘烤(UVCure)
h-10文字印刷(PrintingofLegend)
h-11噴砂(Pumice)(WetBlasting)
h-12印可剝離防焊(PeelableSolderMask)
I.鍍金Goldplating
i-1金手指鍍鎳金(GoldFinger)
i-2電鍍軟金(SoftNi/AuPlating)
i-3浸鎳金(ImmersionNi/Au)(ElectrolessNi/Au)
J.噴錫(HotAirSolderLeveling)
j-1水平噴錫(HorizontalHotAirSolderLeveling)
j-2垂直噴錫(VerticalHotAirSolderLeveling)
j-3超級焊錫(SuperSolder)
j-4.印焊錫突點(SolderBump)
K.成型(Profile)(Form)
k-1撈型(N/CRouting)(Milling)
k-2模具沖(Punch)
k-3板面清洗烘烤(Cleaning&Backing)
k-4V型槽(V-Cut)(V-Scoring)
k-5金手指斜邊(BevelingofG/F)
L.短斷路測試(ElectricalTesting)(Continuity&InsulationTesting)
l-1AOI光學檢查(AOIInspection)
l-2VRS目檢(Verified&Repaired)
l-3汎用型治具測試(UniversalTester)
l-4專用治具測試(DedicatedTester)
l-5飛針測試(FlyingProbe)
M.終檢(FinalVisualInspection)
m-1壓板翹(WarpageRemove)
m-2X-OUT印刷(X-OutMarking)
m-3包裝及出貨(Packing&shipping)
m-4目檢(VisualInspection)
m-5清洗及烘烤(FinalClean&Baking)
m-6護銅劑(ENTEKCu-106A)(OSP)
m-7離子殘餘量測試(IonicContaminationTest)(CleanlinessTest)
m-8冷熱衝擊試驗(ThermalcyclingTesting)
m-9焊錫性試驗(SolderabilityTesting)
N.雷射鑽孔(LaserAblation)
N-1雷射鑽Tooling孔(LaserablationToolingHole)
N-2雷射曝光對位孔(LaserAblationRegistrationHole)
N-3雷射Mask製作(LaserMask)
N-4雷射鑽孔(LaserAblation)
N-5AOI檢查及VRS(AOIInspection&Verified&Repaired)
N-6BlaserAOI(afterDesmearandMicroetching)
N-7除膠渣(Desmear)
N-8微蝕(Microetching)
A/W(artwork)底片Ablation燒溶(laser),切除
abrade粗化abrasionresistance耐磨性
absorption吸收ACC(accept)允收
acceleratedcorrosiontest加速腐蝕acceleratedtest加速試驗
acceleration速化反應accelerator加速劑
acceptable允收activator活化液
activeworkinprocess實際在製品adhesion附著力
adhesivemethod黏著法airinclusion氣泡
airknife風刀amorphouschange不定形的改變
amount總量amylnitrite硝基戊烷
analyzer分析儀anneal回火
annularring環狀墊圈;孔環anodeslime(sludge)陽極泥
anodizing陽極處理AOI(automaticopticalinspection)自動光學檢測
applicabledocuments引用之文件AQLsampling允收水準抽樣
aqueousphotoresist液態光阻aspectratio縱橫比(厚寬比)
Asreceived到貨時backlighting背光
back-up墊板bankedworkinprocess預留在製品
basematerial基材baselineperformance基準績效
batch批betabackscattering貝他射線照射法
beveling切斜邊;斜邊biaxialdeformation二方向之變形
black-oxide黑化blankcontroller空白對照組
blankpanel空板blanking挖空
blip彈開blister氣泡;起泡
blistering氣泡blowhole吹孔
board-thicknesserror板厚錯誤bondingplies黏結層
bow;bowing板彎breakout從平環內破出
bridging搭橋;橋接BTO(BuildToOrder)接單生產
burning燒焦burr毛邊(毛頭)
camcorder一體型攝錄放機carbide碳化物
carlsonpin定位梢carrier載運劑
catalyzing催化catholicsputtering陰極濺射法
caulplate隔板;鋼板calibrationsystemrequirements校驗系統之各種要求
centerbeammethod中心光束法centralprojection集中式投射線
certification認證chamfer倒角(金手指)
chamfering切斜邊;倒角characteristicimpedance特性阻抗
chargetransferoverpotential電量傳遞過電壓chase網框
checkboard棋盤chelator蟹和劑
chemicalbond化學鍵chemicalvapordeposition化學蒸著鍍
circumferentialvoid圓周性之孔破cladmetal包夾金屬
cleanroom無塵室clearance間隙
coat鍍外表coatingerror防焊覆蓋錯誤
coefficientofthermalexpansion(CTE)熱澎脹系數coldsolderjoint冷焊點
cold-weld金屬粉末冷焊color顏色
colorerror顏色錯誤compensation補償
competitiveperformance競爭力績效complexsalt錯化物
complexor錯化物componenthole零件孔
componentside零件面concentric同心
conformance密貼性consumerproducts消費性產品
contactresistance接觸電阻continuousperformance連續發揮效能
contractservice協力廠controlledsplit均裂式
conventionalflow亂流方式conventionaltensiletest傳統張力測試法
conversioncoating轉化層convex突出
coordinatelist資料清單coppercladedlaminates(CCL)銅箔基板
copperexposure線路露銅coppermirror鏡銅
copperpad銅箔圓配copperresidue(coppersplash)銅渣
corrosionratenumbering腐蝕速率計數系統corrosionresistance抗蝕性
coulombslaw庫倫定律countersink喇叭孔
coupon試樣couponlocation試樣點
coveringpower遮蓋力CPU中央處理器
crack破裂;裂痕crazing裂痕;白斑
crosslinking交聯聚合crosstalk呼應作用
crosslinking交聯crystalcollection結晶收集
curing聚合體currentefficiency電流效率
cut-outs挖空cutting裁板
cyanide氰化物cyclesoflearning學習循環
cycle-timereduction交期縮短datecode週期
deburring去毛頭dedicated專用型
degradation退變delamination分層
dent/pinhole凹陷/針孔departmentofdefense國防部
designation字碼簡示法de-smear除膠渣
developing顯影dewetting縮錫
dewettingtime縮錫時間dimensionerror外形尺寸錯誤
dielectricconstant介質常數difficulty困難度
difunctional雙功能dimension尺寸
dimensionstability尺寸安定性dimensionalstability尺度安定性
dimensionandtolerance尺寸與公差dirtyhole孔內異物
discolorhole孔黑;孔灰;氧化
discoloration變色
disposableeyeletmethod消耗性鉚釘法
distortionfactor尺寸變形函數
doubleside雙面板downtime停機時間
drill鑽孔drillbit鑽頭
drillfacet鑽尖切萷面drillpointer鑽尖重(研)磨機
drilledblankboard已鑽孔之裸板drilling鑽孔
dryfilm乾膜ductility延展性
economyofscale經濟規模
edgespacing板邊空地
edge-boardcontact(goldfinger)金手指efficiency能量效率
electrictest電測electricaltesting電測;測試
electrochemicalmachineECM電化學加工法electrochemicalreactor電化學反應器electroforming電鑄electrolessplate化學銅
electroless-deposition無電鍍electropolishing電解拋光
electrorefining電解精鍊electrowinning電解萃取
ellipticalset橢圓形embrittlement脆性
entitlementperformance可達成績效entrapment電鍍夾雜物
epoxy環氧樹酯equipotential電位線
errordatafile異常情形etchrate蝕銅速率
etchants蝕刻液etchback回蝕
evaluationprogram評估用程式exposure曝光
externalpinmethod外部插梢法eyelethole鉚釘孔
Eyeletting鉚眼fabric網布
failure故障fastresponse快速回應
fault瑕庛;缺陷
fiberexposure纖維顯露
fiberprotrusion纖維突出fiducialmark光學點,基準記號
filler填充料film底片
filtration過濾finishedboard成品
fixing固著fixture電測夾具(治具)
flakingoff粹離flammabilityrating燃性等級
flare喇叭形孔flatcable併排電纜
feedbackloop回饋循環first-in-first-out(FIFO)先進先出
flexiblemanufacturingsystem(FMS)彈性製造系統
flux助焊劑
foildistortion銅層變形
fold空泡foreigninclude異物
foreignmaterial基材內異物freeradicalchainpolymerization自由基連鎖聚合
fullyadditive加成法fullyannealedtype徹底回火軔化之類形
function函數fundamentalandbasic基本
fungusresistance抗黴性funnelflange喇叭形摺翼
galvanized加法尼化製程gap鑽尖分開
gaugelength有效長度geltime膠化時間
generalresistink一般阻劑油墨general通論
generalindustrial一般性(電子)工業級geometricallevelling幾何平整
glasstransitiontemperature(Tg)玻璃態轉換溫度
Gold金goldfinger金手指
goldplating鍍金goldenboard標準板
gouges刷磨凹溝gouging挖破
grainboundary金屬晶體之四邊green綠色
grip夾頭groundplane接地層
groundplaneclearance接地空環hackers駭客
HAL(hotairleveling)噴錫haloing白邊;白圈
hardener硬化劑hardness硬度
hepafilter空氣濾清器highperformanceindustrial高性能(電子)工業級
highreliability高可靠度highresolution高解析度
hightemperatureelongation(HTE)高溫延展性銅箔
hightemperatureepoxy(HTE)高溫樹酯
hit擊holecounter數孔機
holediameter孔徑
holediametererror孔徑錯誤
holelocation孔位holenumber孔數
holewallquality孔壁品質hook外弧
hotdip熱浸法hullcell哈氏槽
hybrid混成積體電路hydrogenbonding氫鍵
hydrolysis水解hydrometallurgy濕法冶金法
imageanalysissystem影像分析系統imagetransfer影像轉移
immersiongold浸金(化鎳金)immersionplating浸鍍法
impedance阻抗infraredreflow紅外線重熔
inhibitor熱聚合抑制劑injectionmold射模
ink油墨innerlayer&outlayer內外層
insulationresistance絕緣電阻intendedposition應該在的位置
intensifier增強器intensity強度
intermolecularexchange交互改變interconnection互相連通
ioniccontaminants離子性污染物ioniccontaminationtesting離子污染試驗
IPA異丙醇
inspiration(啟蒙)
identification確認計劃目標implementation改善方案
information數據internalizatio