MPXHZ6116A产品手册datasheet20至115.docx

MPXHZ6116A产品手册datasheet20至115.docx

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MPXHZ6116A产品手册datasheet20至115

MPXHZ6116A

Rev2,06/2010FreescaleSemiconductor

©FreescaleSemiconductor,Inc.,2009,2010.Allrightsreserved.

Pressure

MediaResistantIntegratedSilicon

PressureSensorforMeasuring

AbsolutePressure,On-ChipSignal

Conditioned,Temperature

CompensatedandCalibrated

TheMPXHZ6116Aseriespressuresensorintegrateson-chip,bipolarop

ampcircuitryandthinfilmresistornetworkstoprovideahighoutputsignal

andtemperaturecompensation.Thesensor’spackaginghasbeen

designedtoprovideresistancetohighhumidityconditionsaswellas

commonautomotivemedia.Thesmallformfactorandhighreliabilityofon-

chipintegrationmakethissensoralogicalandeconomicalchoiceforthe

systemdesigner.

TheMPXHZ6116Aseriespressuresensorisastate-of-the-art,

monolithic,signalconditionedsensordesignedforawiderangeof

applications,butparticularlythoseemployingamicrocontrolleror

microprocessorwithA/Dinputs.Thispiezoresistivetransducercombines

advancedmicromachiningtechniques,thin-filmmetallization,andbipolar

processingtoprovideanaccurate,highlevelanalogoutputsignalthatis

proportionaltotheappliedpressure.

Features

•ResistanttoHighHumidityandCommonAutomotiveMedia

•1.43%MaximumErrorover0to85°C

•TemperatureCompensatedfrom-40°Cto+125°C

•DurableThermoplastic（PPSSurfaceMountPackage（SSOP

•IdeallySuitedforMicroprocessororMicrocontroller-BasedSystems

ORDERINGINFORMATION

DeviceName

Package

Options

Case

No.

#ofPortsPressureType

DeviceMarking

NoneSingleDualGaugeDifferentialAbsolute

SuperSmallOutlinePackage（MediaResistantGel（MPXHZ6116ASeries

MPXHZ6116A6URail1317••MPXHZ6116AMPXHZ6116A6T1Tape&Reel1317••MPXHZ6116A

MPXHZ6116A

20to115kPa（2.9to16.7psi

0.399to4.645VOutput

Series

MPXHZ6116A6U/6T1

CASE1317

SUPERSMALLOUTLINEPACKAGE

样品申请:

胡经理

新.磁（上海电子有限公司国际贸易部

首机和Q/Q_1560.183.7360

直拨分机021-31608,531

地址上海浦东张江上丰路/977号/1幢B座

MPXHZ6116ASensors

Pressure

OperatingCharacteristics

Table1.OperatingCharacteristics（VS=5.0Vdc,TA=25°Cunlessotherwisenoted,DecouplingcircuitshowninFigure3requiredtomeetelectricalspecifications.

Characteristic

SymbolMinTypMaxUnitPressureRangePOP20—115kPaSupplyVoltage（11.Deviceisratiometricwithinthisspecifiedexcitationrange.

VS4.755.05.25VdcSupplyCurrentIS—6.010mAdcFullScaleSpan（2（0to85°C2.FullScaleSpan（VFSSisdefinedasthealgebraicdifferencebetweentheoutputvoltageatfullratedpressureandtheoutputvoltageattheminimumratedpressure.VFSS—4.2—VdcOffset（3（0to85°C

3.Offset（Voffisdefinedastheoutputvoltageattheminimumratedpressure.

Voff0.3350.3990.463VdcSensitivityV/P—44.2—mV/kPaAccuracy（4（0to85°C4.Accuracy（errorbudgetisthedeviationinactualoutputfromnominaloutputovertheentirepressurerangeandtemperaturerangeasapercentofVSSspanat25°Cduetoallsourcesoferrorincludingthefollowing:

Linearity:

Outputdeviationfromastraightlinerelationshipwithpressureoverthespecifiedpressurerange.

TemperatureHysteresis:

Outputdeviationatanytemperaturewithintheoperatingtemperaturerange,afterthetemperatureiscycledtoandfromtheminimumormaximumoperatingtemperaturepoints,withzerodifferentialpressureapplied.

PressureHysteresis:

Outputdeviationatanypressurewithinthespecifiedrange,whenthispressureiscycledtoandfromminimumormaximumratedpressureat25°C.

OffsetStability:

Outputdeviation,after1000temperaturecycles,-40°to125°C,and1.5millionpressurecycles,withminimumratedpressureapplied.

TcSpan:

Outputdeviationoverthetemperaturerangeof0°to85°C,relativeto25°C.

TcOffset:

Outputdeviationwithminimumpressureapplied,overthetemperaturerangeof0°to85°C,relativeto25°C.

—-1.5—+1.5%VFSSPressureRange

POP

20

—

115

kPa

MPXHZ6116A

Sensors

Pressure

MaximumRatings

Figure1showsablockdiagramoftheinternalcircuitryintegratedonapressuresensorchip.

Figure1.FullyIntegratedPressureSensorSchematic

Table2.MaximumRatings（1

1.Exposurebeyondthespecifiedlimitsmaycausepermanentdamageordegradationtothedevice.

Rating

SymbolValueUnitsMaximumPressurePmax400kPaStorageTemperatureTstg-40to+125°COperatingTemperature

TA-40to+125

°COutputSourceCurrent@FullScaleOutput（22.MaximumOutputCurrentiscontrolledbyeffectiveimpedancefromVouttoGndorVouttoVSintheapplicationcircuit.

Io++0.5mAdcOutputSinkCurrent@MinimumPressureOffset（2

Io--0.5

mAdc

Pins1,5,6,7,and8areNOCONNECTS

SensingElement

VOUT

VSGainStage#2GND

andGroundReferenceShiftCircuitry

ThinFilmTemperatureCompensation

and

GainStage#1

4

2

3

MPXHZ6116ASensors

Pressure

On-chipTemperatureCompensationandCalibration

Theperformanceovertemperatureisachievedbyintegratingtheshear–stressstraingauge,temperaturecompensation,calibration,andsignalconditioningcircuitryontoasinglemonolithicchip.

Figure2illustratestheconfigurationinthebasicchipcarrier（case1317priortoporting.Ageldiecoatisolatesthediesurfaceandwirebondsfromtheenvironment,whileallowingthepressuresignaltobetransmittedtothesensordiaphragm.Thegeldiecoatanddurablethermoplasticpackageprovideamediaresistantbarrierthatallowsthesensortooperatereliablyinhighhumidityconditionsaswell

ascommonautomotivemedia.NOTE:

TheMPXHZ6116Aseriespressuresensor’soperatingcharacteristics,internalreliabilityandqualificationtestsarebasedonuseofairasthepressuremedia.Media,otherthanair,mayhaveadverseeffectsonsensorperformanceandlong–termreliability.Contactthefactoryforinformationregardingmediacompatibilityinyourapplication.

Figure3showstherecommendeddecouplingcircuitforinterfacingtheintegratedsensortotheA/Dinputofa

microprocessorormicrocontroller.Properdecouplingofthepowersupplyisrecommended.

Figure2.CrossSectionalDiagramSSOP（nottoscale

Figure3.TypicalApplicationCircuit（OutputSourceCurrentOperation

Figure4.Outputvs.AbsolutePressure

WireBondStainlessSteelCapThermoplastic

Case

DieBond

SealedVacuumReference

FluoroSiliconeGelDieCoat

LeadFrame

AbsoluteElement

P1

Die

VSPin2

+5.0V

GNDPin3

VoutPin4

MPXHZ6116A

toADC

100nF

51K47pF

OUTPUT（V

5.0

4.54.03.53.00

20

40

60

80100

2.52.01.51.00.50

140

120

Vout=VS（0.008938xP（kPa-0.09895±（1.5xTMxVS

x0.008938TEMP=0to85ºC

VS=5.0V±0.25MAXMIN

PRESSURE（kPa

NOM

MPXHZ6116A

Sensors

Pressure

TemperatureErrorBand

MPXHZ6116ASERIES

BreakPointsTempMultiplier-402.850to850.96125

1.66

TemperatureinCº

4.03.02.00.0

1.0-40

-20

20

4060140

120

100

80TemperatureErrorFactor（TM

NOTE:

TheTemperatureMultiplierisalinearresponsefrom0ºCto-40ºCandfrom85ºCto125ºC

PressureErrorBand

ErrorLimitsforPressure

3.02.01.0-1.0-2.0-3.0

0.020

Pressure（inkPa

PressureError（kPa

20to115（kPa

±1.5（kPa

40

60

80

100

120

PressureError（Max

MPXHZ6116ASensors

Pressure

MINIMUMRECOMMENDEDFOOTPRINTFORSUPERSMALLPACKAGES

Surfacemountboardlayoutisacriticalportionofthetotaldesign.Thefootprintforthesemiconductorpackagemustbethecorrectsizetoensurepropersolderconnectioninterfacebetweentheboardandthepackage.Withthecorrectpadgeometry,thepackageswillself-alignwhensubjectedtoa

solderreflowprocess.Itisalwaysrecommendedtofabricateboardswithasoldermasklayertoavoidbridgingand/orshortingbetweensolderpads,especiallyontighttolerancesand/ortightlayouts.

Figure5.SSOPFootprint（Case1317

0.027TYP8X0.690.053TYP8X1.35

inchmm

0.3879.83

0.1503.81

0.0501.27TYP

Pressure

PACKAGEDIMENSIONS

CASE1317-04

ISSUEF

SUPERSMALLOUTLINEPACKAGE

MPXHZ6116ASensors

Pressure

PACKAGEDIMENSIONS

CASE1317-04

ISSUEF

SUPERSMALLOUTLINEPACKAGE

MPXHZ6116A

Sensors

Pressure

PACKAGEDIMENSIONS

CASE1317-04

ISSUEF

SUPERSMALLOUTLINEPACKAGE

MPXHZ6116ASensors

MPXHZ6116ARev.2HowtoReachUs:

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