pcb英语.docx

pcb英语.docx

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pcb英语

CommonQuery

I.Boardthickness

1.Lay-up

2.Mismatchbetweenthelay-upboardthicknesses

3.Relaxboardthicknesstolerance

II.Carbonink

III.Cuthickness&Pad

1.AddCuclearanceforNPTHorconsider2nd-drill

2.Adddummypattern

3.Copperclosetoboardedge

4.Copperextendingtounitedge

5.DeleteNPTHpad

6.Distancebetweentwopadslessthan4mil

7.Isolatedfiducialmark

8.Nospacetoenlargepadstoensure2milannualring

9.Padsizeistoosmall

10.PTHholewithellipticpad

11.RelaxCuthicknessonouterlayer

12.RelaxCuthicknessonouterlayer

IV.DWG

1.LabelinDWGisundefined

2.NoDWGwithdimension

3.UnitDWGsizeissmall

V.Generalcriteria

1.Commoncriteria

2.E/Tstamp

3.Ourlogo

4.X-out

VI.Goldfinger

1.Deletesoldermaskbridgebetweengoldfingers

2.Relaxtoleranceforbevelsize

3.Relaxbevelingangleordisregardtheremainingthickness

4.Spacebetweengoldfingeredgeandoutlineistoonarrow

5.Spacebetweentestpadandthetopofgoldfingeristoonarrow

VII.Hole

1.Blind/buriedhole

2.Breakawayholeispartiallyoncopperplane

3.Changeoverlappedholeasslot

4.Drillingpositionaltolerance

5.RelaxtoleranceforNPTH

6.RelaxtoleranceforPTH

7.Repeatedhole

8.Routinghole

9.Rectangularhole

VIII.Impedance

1.Calculatedvaluetrendstothelimit

2.Matchimpedance

3.Referenceplane

4.Whichtraceshouldbecontrolled

IX.Innercorner

Rightangle

X.Outlinedimension

1.Connectiontabfarawayfromunitedge

2.MismatchbetweenCAD/CAMdataandDWG

3.Missdimension

4.Narrowconnectionareabetweenbreakawayholes

5.Notoolinghole

6.Relaxtoleranceforoutlinedimension

7.Uneventolerance

8.Uselessdimension

9.Addovershoot

XI.Packing

XII.Peelablesoldermask

1.Peelablesoldermaskcoveredhole

2.Peelablesoldermaskpluggedhole

3.Relaxthicknessforpeelablesoldermask

4.Withoutthedetaildimensionofpeelablesoldermask

XIII.Silkscreen

1.Markinginholeorpad

2.Markinginlargesoldersurface

3.Legendonsteparea

XIV.Slot

1.Relaxtolerancefornon-platedslot

2.Relaxtoleranceforplatedslot

XV.Soldermask

1.AddS/MBridgeforSMT

2.ChangeS/Mpluggedholetocoveredhole

3.Holesizeistoolargetoplug

4.Holesizeistoosmalltocover

5.Relaxsoldermaskthickness

6.S/Mcovergoldfinger

7.Soldermaskmaterial

8.SpacingistoonarrowtoaddS/MBridge

XVI.Solderthickness

Relaxsolderthickness

XVII.TAB

WithoutTABononerowofunitsatthecenter

XVIII.Tg

TgvalueisnotspecifiedforHighTgmaterial

XIX.Trace

1.ConnectionbetweenCugroundsistoothin

2.Exposedtracefromsoldermaskopening

3.Relaxetchingtolerance

4.Self-spacing

5.Spacingbetweentwotracesistoonarrow

XX.Transferboard

Sampleapproval

XXI.V-Cut

1.DiscontinuousV-Cut

2.RelaxV-Cutremainthicknesstolerance

3.RelaxV-Cutgrooveangletolerance

4.V-Cutremainthicknessistooweak

5.V-CutrunacrossBAT

XXII.Warpage

Relaxwarpage

I.板厚

1.排板结构

2.排板结构和板厚要求不一致

3.释放板厚公差

II.碳油

III.铜厚&Pad

1.为考虑二次钻孔的NPTH加Cuclearance

2.加dummypattern

3.铜距板边太近

4.铜延伸至单元边

5.删除NPTH的PAD

6.相邻两PAD距离小于4mil

7.独立Fiducialmark

8.没有足够的空间来加大PAD以保证2mil焊锡圈

9.Pad尺寸太小

10.有椭圆PAD的PTH孔

11.释放孔壁铜厚

12.释放外层铜厚

IV.DWG

1.图纸标记不明

2.没有标注尺寸的图纸

3.单元图尺寸太小

V.常规Query

1.普通标准

2.E/T印

3.公司logo

4.单元报废

VI.金手指

1.删除金指间的绿油桥

2.释放斜边尺寸公差

3.释放斜边角度或忽略残留厚度

4.金指边离外围太近

5.测试PAD离金指顶部太近

VII.孔

1.盲/埋孔

2.折断孔部分在铜面上

3.改重孔为槽

4.钻孔位置公差

5.释放NPTH公差

6.释放PTH公差

7.重孔

8.锣孔

9.矩形孔

VIII.阻抗

1.阻抗计算值偏向上/下限

2.匹配阻抗

3.阻抗参考面

4.哪一条线要求控制阻抗

IX.内角

内角为直角

X.外形尺寸

1.相连TAB远离单元边

2.CAD/CAM数据与DWG不一致

3.缺少尺寸

4.折断孔连接区域太窄

5.没有工具孔

6.释放外形尺寸公差

7.孔到孔公差不对称

8.无用尺寸

9.加Overshoot

XI.包装要求

XII.Peelablesoldermask

1.蓝胶盖孔

2.蓝胶塞孔

3.释放蓝胶厚度

4.缺少蓝胶详细尺寸

XIII.丝印

1.白字入孔/上PAD

2.白字上大锡面

3.白字部分在铜面上部分在基材上

XIV.槽

1.释放非电镀槽公差

2.释放电镀槽公差

XV.绿油

1.为SMT加绿油桥

2.改绿油塞孔为盖孔

3.孔太大不便绿油塞孔

4.孔太小不便绿油盖孔

5.释放绿油厚度

6.绿油盖金指

7.绿油材料

8.间距太小不便加绿油桥

XVI.铅锡厚度

释放铅锡厚度

XVII.TAB

单元间无TAB

XVIII.Tg

高Tg材料的Tg值未指明

XIX.导线

1.两个Cuground间连接太小

2.绿油开窗露线

3.释放蚀刻公差

4.线路自身间距太小

5.线间太窄

XX.转板

样板转生产板

XXI.V-Cut

1.跳V-Cut

2.释放V-Cut残留厚度公差

3.释放V-Cut槽角度公差

4.V-Cut残留厚度太小

5.V-Cut穿过BAT

XXII.板曲

释放板曲

Straightmatter

I.Boardthickness

1.Lay-up

InDWG,customermentionedlayerorderonly,butdidn'tindicatethedielectricthicknessbetweenlayersandCopperthickness.So,wesuggestyoufollowthelay-upshownonattachedfileXX.Pleaseconfirm.

2.Mismatchbetweenthelay-upandboardthickness

Accordingtothelay-upspecifiedbycustomer,theoverallboardthicknesswillbeXXXmil,notthecustomernominalrequirementofYYYmil.So,wesuggest:

A）.Tofollowthelay-upspecifiedbycustomerandchangetheoverallboardthicknesstoYYYmil+/-10%,OR

B）.Tomodifythelay-up